Research Progress of Electroplated Micropore for Interconnection Technology
نویسندگان
چکیده
Abstract Electroplated micropore interconnection is one of the core technologies to realize electronic connections high-density multilayer Printed circuit board (PCB). The quality electroplated copper layer a key factor for reliability PCB and components. Focusing on acid plating process, this paper expounds development electroplating solution additives, mechanisms deposition hole filling mechanism, process control electroplating, which will provide reference in-depth study technology.
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ژورنال
عنوان ژورنال: Journal of physics
سال: 2023
ISSN: ['0022-3700', '1747-3721', '0368-3508', '1747-3713']
DOI: https://doi.org/10.1088/1742-6596/2430/1/012011